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Dear reader,

A laborious year 2016 is closing, in which we have laid the foundation for much improved Time-of-Flight performance and for several new product launches in 2017. We will begin the new year with the launch of a new spectrometer chip product at Photonics West in San Francisco. In the consecutive months we will extend our ToF product line with a 160x60 and a fast 8x8 pixel array. With these new products we respond to your requirements and to many technical discussions.
We are looking forward to a promising 2017 and to continue our successful collaboration with you. Thank you very much for your commitment to ESPROS technology!

We wish you a wonderful holiday season and a great start into an exciting year 2017.

Best regards from Sargans,

Beat De Coi

«Start by doing what's necessary, then do what's possible; and suddenly you are doing the impossible.»
Francis of Assisi

With our Time-of-Flight chips being used in more and more volume products, proper chip assembly is becoming important for obtaining best performance and maximum product lifetime.
We have updated our application note on chip assembly with latest information.


ESPROS is using the very small SMD compatible wafer-level chip-scale (WL-CSP) package technology (refer to Figure 1). It allows miniaturization, gives a high fill-factor on PCB boards and is cost competitive. Due to the very thin (50
µm for optical performance) substrates, the assembly process needs special attention. The chips are quite brittle and need careful handling.

Figure 1: epc901 with WL-CSP32 package. Note the high aspect ratio of 8.0 x 1.3 mm. 
Figure 2: Well done underfilling. View of PCB with chip removed. 
You want to
learn more about it?


Than have a look into the latest version of our Application Note AN08 with assembly process guidelines. The document is available on the ESPROS Website in the section Application Notes.

For further questions, please contact your local ESPROS sales office for supporting you.
View Document
Contact ESPROS for further questions
Our heart beats for
 
INCREDIBLY SMALL
SPECTROMETERS

For quite some time we have been searching for micro-patterned spectral filter arrays to combine them with our imager technology.
We found the perfect solution and a great cooperation partner at VIAVI Solutions. Their 8x8 filter arrays in the visible or near infrared regime are a perfect match for our sensitive chip. Filter and imager combine to a miniature size spectral sensor with 64 channel resolution with only
2.7 x 2.7 mm footprint and 1.1 mm height. This spectral sensor can be directly illuminated with the to be analyzed light and does not need any further grating or prism setup. Like in the case of our ToF imagers, the high quantum efficiency and 100% fill factor of our CCD/CMOS process results in high signal strength
and therefore fast analysis.

Product Information
Filter
  • Micro-array with 8x8 filter segments
  • Segment has 100x100 micron size
  • 64 equidistant channels for VIS or NIR regime
  • VIS: 400 – 900 nm
  • NIR: 775 – 1075 nm
  • Filter bandwidth (FWHM) is 20 nm in VIS and 5 nm in NIR wavelength regime
Imager
  • Backside illuminated
  • 100% fill factor
  • Exposure time: 1-10'000 μs
  • > 100 spectra per second
Developer Kit
  • Graphical user interface and API interface for professional integration
  • 8 LED selectable light sources: UV, blue, green, red, 850nm, 940nm, white, broadband NIR
Applications
  • Color measurement
  • Multispectral imaging
  • Biometrics, health and fitness
  • Ambient light analysis
  • Characterization of food, feed, agricultural products, pharmaceuticals
  • Printing and photography
  • Oil and fuel quality analysis
  • Process control
  • Factory automation
  • Graphics

HOW YOU GET IT

Espros and Viavi Solutions launch the new miniaturized spectral sensing system on a chip at Photonics West in San Francisco.

SPIE BiOS
28 - 29 January 2017,
Booth 8640

SPIE Photonics West
31 January - 2 February 2017,
Booth 5330

Product Demonstration
Tuesday, 31 January:
12pm - 12.30pm
Copyright © 2016, ESPROS Photonics Corporation, All rights reserved.
Pictures: ESPROS Photonics Corporation, Viavisolutions

Our mailing address is:
info@espros.com

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